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Analysis of Grinding Mechanics and Improved Force Model in Ultrasonic Assisted Grinding Cf/SiC Composites

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Analysis of Grinding Mechanics and Improved Force Model in Ultrasonic Assisted Grinding Cf/SiC Composites

Author Information
1
Key Lab of Industrial Fluid Energy Conservation and Pollution Control, Ministry of Education, Qingdao University of Technology, Qingdao 266520, China
2
Yantai Zhenghai Magnetic Material Co., Ltd., Yantai 264006, China
3
Qingdao Hainuo Machinery Production Co., Ltd., Qingdao 266000, China
4
School of Mechanical and Electrical Engineering, Qingdao Binhai University, Qingdao 266540, China
5
Qingdao Siasun Robot & Automation Co., Ltd., Qingdao 266114, China
*
Authors to whom correspondence should be addressed.

Received: 08 December 2025 Revised: 13 January 2026 Accepted: 03 February 2026 Published: 25 February 2026

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© 2026 The authors. This is an open access article under the Creative Commons Attribution 4.0 International License (https://creativecommons.org/licenses/by/4.0/).

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Intell. Sustain. Manuf. 2026, 3(1), 10004; DOI: 10.70322/ism.2026.10004
ABSTRACT: Grinding is a key precision machining method for achieving high surface quality and dimensional accuracy in carbon fiber reinforced silicon carbide ceramic matrix composites (Cf/SiC). Ultrasonic vibration-assisted grinding (UVAG), with its high-frequency intermittent loading characteristics, offers a novel approach to regulating the dynamic removal behavior of heterogeneous materials. This study firstly analyzed the material removal mechanism of abrasive particles based on abrasive geometry and kinematics. On this basis, mechanical models are developed for a single abrasive grain across three removal stages: ductile removal, ductile-to-brittle transition, and brittle removal. These are further extended into a grinding force prediction model by integrating the effects of multiple abrasive grains and process correction factors during ultrasonic-assisted grinding. Finally, the model is validated through UVAG experiments. Results show that under an ultrasonic frequency of 20 kHz and amplitude of 5 μm, the predicted grinding forces match the experimental values with a high degree of accuracy (98.98%). This grinding force model provides theoretical support and process guidance for high-performance, low-damage precision machining of Cf/SiC composites.
Keywords: Grinding; Ceramic matrix composites; Ultrasonic vibration; Removal mechanism; Grinding force model
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